CREE XHP50 J2 on Star PCB (6v)

XHP50A-00-0000-0D0BJ20E7

Description

The features:

• Maximum drive current: 3000 mA (6V)
• Binned at 85 °C
• Configurable to 6 V or 12 V by PCB layout
• Low thermal resistance: 1.2 °C/W
• Wide viewing angle: 120°
• Unlimited floor life at = 30 ºC/85% RH
• Reflow solderable - JEDEC J-STD-020C
• RoHS-compliant
• UL® recognized component(E349212)

Successful usage of high power LEDs:

Heat management
Applications with high power LEDs need enduring, adequate and plane heat conduction from the first moment of use. It is very important and neccessary to get the heat off the devices to ensure the maximum light output, lifetime and efficiancy.

Drive management
LEDs should be run with a constant current in addition to the manufacturers recommendations. To ensure this we recommend to take constant current power supplies because resistors are always a risk factor in high power LED applications.

IP protection
Unless otherwise stated, the modules are not protected against high humidity or splashing water. If LEDs are used in areas that require increased protection, this must be manufactured according to the requirements.

EMC protection
LEDs are sensitive against heat and electric charge. Please avoid any kind of short circuits or electric discharge to the illuminant. The chip can be damaged or even destroyed.

Storage / JEDEC level
The storage temperature should be from -30°C up to + 80°C in dry ambience. After opening a sealed bag the content should be mounted rapidly. Once absorbed humidity can be removed by tempering the LEDs in some cases. More information can be found in the manufacturers datasheets or on the manufacturer homepages.

Soldering conditions
Each LED has its own soldering conditions that the user should pay attention to. After the launched lead free processing specifications many standarts have changed. Information about recommended soldering can be found in the manufacturers datasheets or on the manufacturer homepages.